-------------------------------------------------------------------- SEMINAR OF THE LABORATORY FOR COMPUTER DESIGN OF MATERIALS Institute for Computational Sciences and Informatics CSI 929 (http://science.gmu.edu/physics/seminar/schedule.html) -------------------------------------------------------------------- Ion-implantation doping of SiC and GaN Mulpuri V. Rao Deptment of Electrical and Computer Engineering George Mason University Ion implantation is the only selective area doping technique available for the fabrication of palanar SiC and GaN integrated circuits. Thermal diffusion is not feasible due to the low diffusion coefficient of the dopants at temperatures where thermal dissociation of the compound does not occur. We have performed N and Al ion implantations into 6H-SiC at elevated temperatures (700-800 C) to obtain n- and p-type regions, respectively. Post-implantation annealing was performed using a ceramic processing furnace or microwaves. The annealings were performed at temperatures up to 1600 C. The N implantation yielded n-type regions with a maximum room temperature carrier concentration of 2 10^19 cm-3 and good crystalline quality. Diodes made by N implantation into p-type 6H-SiC have a forward turn-on voltage of 2.2 V and an ideality factor of 1.9 with nA range reverse leakage current. The Al implantation gave p-type regions with high 10^18 cm-3 range room temperature carrier concentration. Since annealing is a required step after implantation, heat treatment studies wre performed on GaN layers grown on sapphire. For rapid thermal annealing (RTA), formation of liquid Ga droplets, due to N evaporation, is observed on the GaN surface after 1100 C annealing. Evaporation of N can be minimized by using a GaN or SI3N4 proximity cap during annealing. Activation of the Si implant was observed only for annealing temperatures > 1100 C. Higher Si activation was observed when the implants were perfomed at elevated temperatures. No activation of Mg was observed with or without P coimplantation. Monday , April 22 1996 5:00 pm Room 206, Science & Tech. I -------------------------------------------------------------------