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   COLLOQUIUM OF THE LABORATORY FOR COMPUTER DESIGN OF MATERIALS
                   School of Computational Sciences
                           (CSI 898-Sec 001)
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    Nanoscale Process Monitoring and Control in Chemical Mechanical 
 Planarization: A Multiresolution Analysis and Machine Learning Approach

                             Rajesh Ganesan
   Systems Engineering and Operations Research, George Mason University

Efficient real line monitoring and control of Chemical Mechanical
Planarization (CMP) process in silicon wafer polishing has emerged as a
critical research topic owing to the nanoscale nature of the process, lack
of accurate process control models, and the ever increasing demands placed
on the quality and throughput of the semiconductor manufacturing processes.
This talk presents a novel strategy to monitor and control the CMP process
using Multiresolution Analysis and Machine Learning. Results indicate that
this strategy is robust and is capable of real time monitoring for defect
and end point identification, and controlling the process with a lower
variance in comparison to existing methods.

                         November 21, 4:30 pm
               Room 206, Science & Tech. I, Fairfax Campus

Refreshments will be served at 4:15 PM.
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Find the schedule at http://www.scs.gmu.edu/lcdm/seminar/schedule.html
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